SPICE Model

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Modeling experts of MoDeCH provide customers with our unique SPICE modeling services including TEG design assistance for extraction, selection of an optimum device model, parameter extraction, and technical support to meet customers’ needs. Moreover, to improve simulation accuracy at most, we will develop macro models as needed. This offers highest accuracy SPICE parameters suitable for the customers’ needs.

SPICE model

オンウェハデバイス  

On-wafer Devices

We provide a customized comprehensive solution for on wafer device modeling from TEG design assistance, on wafer measurement, optimal model selection to accurate device parameter extraction.

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On-board Components

Modeling service of electronic components on board. You can obtain high-precision model easily.

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